There has been a growing demand for microwave circuitry designing and development to reduce product size, eliminate unwanted radiations, avoid cross talk, cut back on the cost of production, and achieve electromagnetic compatibility (EMC). All this has created the need for board level multi-cavity shielding. Although the labyrinth and lid shielding approach has evolved as a popular method, there are other alternatives to it. These include a large number of shielding cans and labyrinth pulverized from solid metals such as aluminum. If you use multiple cans, there may be a significant increase in the printed circuit board real estate due to dual tracks for every can as well as the space needed between the containers for adjoining spring finger fittings. There are issues with the labyrinth approach as the wall shall be much thicker than the photochemical machining process. Consequently, the connection to the printed circuit board will not be effective like a seam-soldered joint. Read on to learn about the methods associated with screening enclosures. Use of Base Material You can pick out a base material depending on the incidence and type of the emitted signal that the labyrinth must shield. We recommend that you use a non-ferrous material for controlling electromagnetic interference (EMI) and high frequencies. However, you can use ferrous materials for lower frequencies. Plate Finishes You will need plating finishes to help in solderability, check oxidation, help in radiation reflection, and improve surface conductivity. If you want the enclosures to be properly soldered using reflow or any other methods, the plate finishing should have a melting point apart from that of the solder. Non-Ferrous Materials for High-Frequency Applications If you are using high- frequency devices or applications such as AD or DA converters, microcontrollers, fast logic and switching devices, microwave amplifiers, peripheral devices, and microprocessors, use copper, phosphor bronze, brass, and beryllium-copper, which are all non-ferrous materials. Ferrous Materials for Low-Frequency Devices Low-frequency devices and equipment applications such as electromagnetic coils, wire wound transformers, audio and sonic frequency components, relays, and circuit breakers require ferrous materials like mu-metal, steel, molybdenum, and radio metal. Of these, mu-metal, molybdenum, and radio metal have an innate and delicate magnetic field that is effective in reducing EMI. Material Thickness for High-Frequency Applications You will require a material thickness of about 0.5 millimeters for high-frequency applications. Since these applications function on the principles of reflection, thickness is not much of a problem. There are other aspects to consider like maximizing the connection to the circuit board, choice of a non-ferrous base material, and the assembly quality with respect to soldering to the ground. Photochemical Machining The photochemical machining (PCM) process employs corrosive materials like acids for etching in place of hard-cutting tools. It results in the development of composite profiles using a range of sheet metals such as brass, copper, mu-metal, aluminum, nickel-silver, and aluminum. The benefit of the PCM process is its use of part etching. This method helps to create fold lines that aid in the formation of an EMI shielding enclosure from flat materials. The designers assemble the enclosures with soldered or spot welded joints. The process leads to the formation of complete internal walls with separate lids and intricate labyrinths with spring fingers, screw fittings, or tags. Benefits of the PCM Process There are several benefits of the PCM process. The list includes high-quality finishing, low tooling cost, half-etched bend lines, less modification cost, the potential for tooling several metals, no impact on magnetic properties, removal of stress and burrs, simplified tooling for complicated designs, quick supply of prototypes, and quick turnaround of the original design or its modifications. Avoiding Microphony Problems There are other factors that you must consider while designing enclosures at high frequencies. They are the wave-guide impact on cavities and microphony. You can get rid of these issues with appropriate cavity design and the use of thick materials. You can eliminate the wave-guide effect by choosing the right cavity size and distribution of circuitry in every cavity. The demand for board level shielding solutions has increased with electronic devices and applications becoming smaller and sophisticated. Multi-cavity shielding is imperative for devices with increased digital clock speeds and higher operational frequencies.
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