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Read The Latest Newsletter from Semi-Probes, Inc.
We've just published a new edition of our newsletter! You can check it out on our website and get the latest information from Semi-Probes, Inc.. Let us know what you think! Read It Now Here ...read more
By Semi-Probes, Inc. July 21, 2012
Z1 Series Solder Bump Vertical Probe Card Features
Description:Semi-Probes, Inc. Z1 series solder bump vertical probe card is comprised of a high performance series pogo pin with a BeCu alloy contact and a stainless steel alloy with a gold plated spring. The measurements of the high performance BeCu alloy pogo pin and the gold plated stainless steel alloy spring yields a, very, high speed (31.3 Ghz @ -1dB and 32.2 Ghz @ -3dB) and current (3.00Amps @ 20 degrees Celsis T-Rise, 4.10Amps @ 40 degrees Celsis T-Rise and 5.10Amps @ 60 degrees Celsis T-Rise) in addition to a, very, low inductance (1.00nH) and capacitance (0.21pF). Semi-Probes, Inc. Vertical probe card is, currently, available in multiple tip shapes (crown, radius and sharp). All of which can be achieved at a minimum cost and lead-time. Semi-Probes, Inc.Z1 Series Solder Bump Vertical Probe Card Specifications:Mechanical: Minimum Pad Pitch.0157”-upPogo Pin Depth.105”-.120” @ first contact and .090”-.105” @ final contactSpring Force40 grams @ .015” overdriveMechanical Life100,000 cyclesElectrical: Average DC Resistance40 mOhmsCurrent Capacity3.00Amps @ 20 degrees Celsis T-Rise, 4.10Amps @ 40 degrees Celsis T-Rise and 5.10Amps @ 60 degrees Celsis T-RiseBandwidth (Ghz)31.3 Ghz @ -1dB and 32.2 Ghz @ -3dBInductance (Ls)1.00nHCapacitance (Cs)0.21pFMaterials and Finishes:ContactBeryllium copper alloy with proprietary platingSpringSteel alloy with gold plating over hard nickelEnvironmental:Operating Temperature-55 degrees Celsis to 155 degrees Celsis ...read more
By Semi-Probes, Inc. July 21, 2012
Probe Material Characteristics
Purpose:The purpose of this document is to define the probe material characteristics for probe cards built on a defined standard procedure. Industry Standards are used to maintain consistent probing results. Deviations from these specifications are expected due to individual measuring skills. In general all specifications will have the notation for minimum and maximum tolerances.Probe Needle Material:Considerations of probe materials are contact resistance, needle life, and the amount of damage that the die pads will be subjected to during probing.MaterialPros:Cons: Tungsten(WNP)1) Long service life2) Consistent contact pressurewith repeated use3) Effective in breaking through aluminum oxide1) Contact resistance tends to rise with improper care and cleaning procedures2) Begins at 250 milliohms stabilizes at >5 ohms Tungsten- Rhenium(WRNP)1) Even longer service life2) Consistent contact pressurewith repeated use3) Effective in breaking through aluminum oxide1) Contact resistance tends to rise with improper care and cleaning procedures2) Begins at 250 milliohms stabilizes at >5 ohms Beryllium Copper(BC)1) Used mainly for gold padapplications2) Low, stable contact resistance approx. 200 milliohms3) Can be run with reduced overdrive to achieve less pad damage1) Shorter service life2) Will need to be replaced at almost twice the rate astungsten probes.HardenedBeryllium Copper(HBC)1) Used mainly for gold padapplications2) Low, stable contact resistance approx. 200 milliohms3) Increased gram force allows a reduction in overdrive to achieve less pad damage1) Shorter service life2) Will need to be replaced at almost one and a third the rate as tungsten probes. Palladium(P)1) Same as BeCu2) Best use for gold bump pads to minimize pad damage.1) Softer still than BeCu ...read more
By Semi-Probes, Inc. July 20, 2012